Evaluating Electrically Insulating Epoxies

June 22, 2015

New White Paper from Master Bond

Learn how fundamental electrical properties of epoxies, such as dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity, are measured and what values are desirable. The specific composition of resin and curing agents as well as changes in temperature, fillers and other variables will also affect the electrical properties of a cured epoxy system. Three major types of curing agents are explained along with their benefits and trade-offs with respect to electrical properties.

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Also from Master Bond:

No Mix Epoxy Offers Superior Chemical Resistance


Featuring superior flow properties, Master Bond EP19HT is ideal for high performance impregnation as well as sealing and coating applications with an exceptionally low viscosity of 300-700 cps. It has a remarkable strength profile and adheres well to a variety of substrates such as ceramics, metals, composites, glass and many plastics. This compound is also serviceable over the wide temperature range of -60°F to 400°F. For more information, request a technical data sheet on EP19HT

Flexibilized Epoxy Cures Rapidly at Room Temperature


Two component Master Bond EP51FL-1 epoxy system can withstand extreme heat and cold, from -100°F to 250°F. This adhesive forms strong, flexible bonds that are capable of adhering to dissimilar substrates. It sets up in just 30-40 minutes at ambient temperatures, with a full cure occurring in 24 hours. EP51FL-1 is an excellent thermal and electric insulator, and maintains outstanding chemical resistance. Elongation at 75°F is >200%. For more information, request a technical data sheet on EP51FL-1

Low Viscosity Conformal Coating Cures Quickly


Master Bond MasterSil 773 is an ultra low viscosity, solvent-free, one component silicone based conformal coating. This system has a viscosity of 60-70 cps at 75°F. It is designed to provide protection to electronic circuitry in high humidity environments and resistance to shock and vibration. This highly flexible, low hardness system is very easy to repair and has a fast tack-free time. A most useful feature of MasterSil 773 is that it maintains its low modulus over the wide temperature range of -80°F to in excess of 300°F. For more information, request a technical data sheet on MasterSil 773

Urethane Modified Epoxy Gel System Is Optically Clear


Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with superb dimensional stability. It can be cast in sections up to 2-3 inches thick due to its thin viscosity and low exotherm. Super Gel 9 combines easy handling and curing properties, making it ideal for potting/encapsulation sensitive electronic parts and delicate optical components. For more information, request a technical data sheet on Super Gel 9

Thermally Conductive B-Stage Epoxy


Toughened, one component EP36AN features outstanding thermal shock resistance and a thermal conductivity of 21 BTU•in/ft2•hr•°F over the wide temperature range of -100°F to 500°F. It is available for use in convenient 30 gram cookies. EP36AN has reliable adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers exceptional electrical insulation properties. For more information, request a technical data sheet on EP36AN

UV Curable System Has Exceptional Temperature Resistance


With a glass transition temperature exceeding 180°C, UV25 offers impressive thermal stability over the broad service temperature range of -60°F to 500°F. This one part, fast curing, moderate viscosity UV curable system bonds well to glass, surface treated metals, plastics such as polycarbonates, acrylics, among others. Additionally, this material is optically clear with a refractive index of 1.55 at room temperature. For more information, request a technical data sheet on UV25